Microfluidics Manufacturing: What is Anodic Bonding?

Posted By Juan Berganza / Technology Blog / MEMS, microfluidic chip, microfluidics / No hay comentarios

 

Anodic bonding between glass and silicon through electric fields

Anodic bonding between glass and silicon through electric fields

Microfluidics Manufacturing: Anodic Bonding

The Bonder enables Anodic Bonding  (Sealing)  between a Silicon wafer and  a Crystal Wafer. This seal is used primarily for connecting silicon / glass and metal / glass through electric fields.

The requirements for anodic bonding are cleaned surfaces availability  on both  wafers  and the atomic contact between the binding substrates through an electrostatic field  should be strong enough

Leave a Comment


*

where are we ? click for google map